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see  ->Other Chips (40)
02624(2009/9/3)
Part No:  
D65855RE11
 
Package:  
PGA
M.F.G.:  
NEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
9535
Comments:  
NEC D65855RE11 9535K 金镶玉嵌银
02626(2009/9/3)
Part No:  
D65875RE22
  
Package:  
PGA
M.F.G.:  
NEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
9538
Comments:  
NEC D65875RE22 9538K2
02110(2007/10/24)
Part No:  
100-4770-02
  
Package:  
BGA
M.F.G.:  
Sun
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
01919(2007/9/19)
Part No:  
1X89-0401 9822
  
Package:  
PGA
M.F.G.:  
HP
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
型号:HP9000小型机 应用:铁路信号,电动道岔控制 系统:UNIX 控制板上的CPU 2-1
01920(2007/9/19)
Part No:  
1X89-0401 9826
  
Package:  
PGA
M.F.G.:  
HP
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
型号:HP9000小型机 应用:铁路信号,电动道岔控制 系统:UNIX 控制板上的CPU 2-2
02359(2008/5/21)
Part No:  
21164-P6 433
  
Package:  
PGA+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
9813
Comments:  
小型机的CPU DIGITAL SEMICONDUCTOR TM DEC 1995 1026J JD2198 H 9813 KKB E56 KA816LE940
02358(2008/5/21)
Part No:  
21164-P7 500
  
Package:  
PGA+SLOT
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
9809
Comments:  
小型机的CPU DIGITAL SEMICONDUCTOR TM DEC1996 1073D JD1885 H 9809 KKB E56 KA814J8631 54-24801-06 DEC97 HA9805
02407(2008/7/24)
Part No:  
57G962 9604
  
Package:  
BQFP
M.F.G.:  
Intel
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
02406(2008/7/24)
Part No:  
596D-25
  
Package:  
BQFP
M.F.G.:  
Intel
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
01922(2007/9/19)
Part No:  
A3261 NPST9A5412
  
Package:  
白色陶瓷底金顶LGA
M.F.G.:  
HP
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
型号:HP9000小型机 应用:铁路信号,电动道岔控制 系统:UNIX 控制板上的CPU A3261 60006 REV A USA 的部分,加上了带二缓的卡座,散热器太大了 2-2
01921(2007/9/19)
Part No:  
A3261 NPST9A5516
  
Package:  
白色陶瓷底金顶LGA
M.F.G.:  
HP
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
型号:HP9000小型机 应用:铁路信号,电动道岔控制 系统:UNIX 控制板上的CPU A3261 60006 REV A USA 2-1的部分
02625(2009/9/3)
Part No:  
D65855RE11
  
Package:  
PGA
M.F.G.:  
NEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
9535
Comments:  
NEC D65855RE11 9535K1 金镶玉嵌银
01825(2007/7/24)
Part No:  
D78013FYCW W18
  
Package:  
DIP
M.F.G.:  
NEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
NEC-21-CRT-CPU
02294(2008/5/3)
Part No:  
DC1084E
  
Package:  
BGA
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
9931
Comments:  
02293(2008/5/3)
Part No:  
DC1118A
  
Package:  
BGA
M.F.G.:  
DEC
Class:  
Other Chips
Owner:  
see
MfgDate:  
9916
Comments:  
02497(2008/10/7)
Part No:  
E30010
  
Package:  
QFP
M.F.G.:  
Other MFG
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
MIMAKI大喷机的CPU
02498(2008/10/7)
Part No:  
E300159
  
Package:  
QFP
M.F.G.:  
Other MFG
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
MIMAKI写真机的CPU
02402(2008/7/23)
Part No:  
IBM930380026W
  
Package:  
C-BGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 4-1
02403(2008/7/23)
Part No:  
IBM930380026W
  
Package:  
C-BGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 4-2
02405(2008/7/24)
Part No:  
IBM931432G0679PG
  
Package:  
pga
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 4-4 没有散热器的IBM931432G0679PG
02404(2008/7/24)
Part No:  
IBM931432G0679PG
  
Package:  
PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 4-3
02412(2008/7/25)
Part No:  
IBM9314PQ32G0658ESD
  
Package:  
PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 6A-5
02413(2008/7/25)
Part No:  
IBM9314PQ32G0658ESD
  
Package:  
PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 6A-6
02410(2008/7/25)
Part No:  
IBM9314PQ32G0658ESD
  
Package:  
PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 6A-3
02411(2008/7/25)
Part No:  
IBM9314PQ32G0658ESD
  
Package:  
PGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
IBM小型机 6A-4
02159(2007/11/27)
Part No:  
KU82596CA33
  
Package:  
BQFP
M.F.G.:  
Intel
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
02277(2008/4/27)
Part No:  
L1A7258
  
Package:  
PGA
M.F.G.:  
LSI
Class:  
Other Chips
Owner:  
see
MfgDate:  
9348
Comments:  
C46583P 5 FT DAA
02575(2009/5/21)
Part No:  
L2A0458
  
Package:  
QFP+BGA
M.F.G.:  
LSI
Class:  
Other Chips
Owner:  
see
MfgDate:  
96
Comments:  
LSI的CPU 网络视频终端编辑机
02276(2008/4/27)
Part No:  
li87596
  
Package:  
pga
M.F.G.:  
LSI
Class:  
Other Chips
Owner:  
see
MfgDate:  
9351
Comments:  
LSI FU DAA C46910C 3
02309(2008/5/15)
Part No:  
LIA9162
  
Package:  
PGA
M.F.G.:  
LSI
Class:  
Other Chips
Owner:  
see
MfgDate:  
9439
Comments:  
COMPAQ 康柏
02231(2008/4/14)
Part No:  
MB87030
  
Package:  
PGA
M.F.G.:  
Fujitsu
Class:  
Other Chips
Owner:  
see
MfgDate:  
8916
Comments:  
02396(2008/7/2)
Part No:  
ORCAM5P 1.2
  
Package:  
SLOT+BGA
M.F.G.:  
IBM
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
双PowerPC.DEC小型机CPU
02548(2009/3/15)
Part No:  
RM5231-200Q
  
Package:  
QFP
M.F.G.:  
Other MFG
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
RM5231-200Q Microprocessor with 32-Bit System Bus Data Sheet Released 制造商 PMC-Sierra, Inc 机型 NC900 网络存储
02547(2009/3/15)
Part No:  
RM5231-200Q
 
Package:  
QFP
M.F.G.:  
Other MFG
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
RM5231-200Q Microprocessor with 32-Bit System Bus Data Sheet Released 制造商 PMC-Sierra, Inc 机型 NC900 网络存储
01824(2007/7/17)
Part No:  
S3C4510B01-QERO
  
Package:  
PQFP
M.F.G.:  
Other MFG
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
SAMSUNG 三星生产的网落通讯专用CPU
02152(2007/11/18)
Part No:  
SONY PS2 CPU
  
Package:  
BGA
M.F.G.:  
Sony
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
SONY PS2早期的CPU---被热炒一时的"情感中央处理器"即"EE"EmotionEngine 情感引擎,后期的是EE+GS,CPU和GPU被集成在一起了.不集成的比较少.
02151(2007/11/18)
Part No:  
SONY PS2 GPU
  
Package:  
BGA
M.F.G.:  
Sony
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
PS2游戏机早期的GPU,后期的CPU和GPU被封装在同一芯片里了
01821(2007/7/17)
Part No:  
StarTAC-338C
  
Package:  
M-BGA
M.F.G.:  
Motorola
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
摩托罗拉338C手机的CPU
01826(2007/7/24)
Part No:  
V53189
  
Package:  
DIP
M.F.G.:  
Philips
Class:  
Other Chips
Owner:  
see
MfgDate:  
Comments:  
PHILIPS-CRT-CPU
02191(2007/12/16)
Part No:  
VP21412-53-00842
  
Package:  
PGA
M.F.G.:  
Philips
Class:  
Other Chips
Owner:  
see
MfgDate:  
9728
Comments:  
VLSI 9728 B982381 VP21412-53-00842 3COM PHILIPPINES
   
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